▎ 摘　　要

NOVELTY - Corrosion-resistant copper clad laminate comprises a substrate (1), heat dissipation layer (2), which is arranged on the upper and lower surfaces of the substrate, an insulating layer (3) covers the surface of the heat dissipation layer far away from the substrate, and an adhesive layer (4) covers surface of the insulating layer and the far heat dissipation layer. A copper foil layer (5), which is arranged on the outer surface of the adhesive layer, wear-resistant layer covered on the surface of the copper foil layer and the remote adhesive layer and corrosion resistance layer (7) covers the outer surface of the corrosion-resistant layer (6). USE - Corrosion-resistant copper clad laminate. ADVANTAGE - The corrosion-resistant copper clad laminate prevents the copper clad laminate from being corroded, design is reasonable, and the design of the heat dissipation layer enables the copper clad plate to strengthen the heat dissipation of the portion of the copper clad plate, increases the heat dissipation efficiency of the heating electronic component, increases the service life of the electronic component, and prevents the copper clad laminate from being corroded. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing corrosion-resistant copper clad laminate, which involves: (A) preparing adhesive layer by weighing 50-80 pts. wt. epoxy resin, 10-80 pts. wt. toughening agent, 10-20 pts. wt. flame retardant, 5-8 pts. wt. diluent, then dissolve with organic solvent, adding 10-15 pts. wt. curing agent, 3-5 pts. wt. water-absorbing agent, and stirring for 30 minutes until the system is completely uniform, and preparing liquid crystal epoxy resin adhesive; (B) weighing the copper powder and graphite powder at a weight ratio of 1000:2-5, and placingthe weighed copper powder and graphite powder mixed powder in the sealing substrate mold, sintering at a pressure of 50 megapascals (MPa) and a temperature of 800 degrees C for 10 minutes and obtaining copper-based composite substrate; and (C) cutting obtained copper-based composite substrate and copper foil according to specifications, and arranging the copper-based composite substrate and copper foil, arranging graphene and epoxy resin on both sides of the copper-based composite substrate, and applying adhesive on the inner and outer sides of the copper foil, and applying ultra-high molecular weight polyethylene and silicon dioxide on the outside of the copper foil layer, formed whole is continuously pressed at 150 degrees C, and curing in an oven at 150-180 degrees C for 1-3 hours to obtain a flexible copper clad laminate with high dielectric properties. DESCRIPTION OF DRAWING(S) - The drawing shows schematic view of corrosion-resistant copper clad laminate. Substrate (1) Heat dissipation layer (2) Insulating layer (3) Adhesive layer (4) Copper foil layer (5) Corrosion-resistant layer (6) Corrosion resistance layer (7)