▎ 摘　　要

NOVELTY - Preparing graphene printed circuit board (PCB), comprises (i) placing graphene film directly on one side or both sides of the dielectric substrate material to obtain semi-finished graphene PCB, and clamping the semi-finished graphene PCB between two mirror steel plates as samples to be pressed, and (ii) placing sample to be pressed in vacuum state under pressure of 4-10 MPa at room temperature for 10-30 minutes, then vacuuming for 30-60 minutes to heat up at 180-380 degrees C, and increasing pressure to 12-15 MPa, maintaining for 60-120 minutes, cooling to room temperature, and removing mirror steel plate to obtain final product. USE - The method is useful for preparing graphene PCB. ADVANTAGE - The method: is simple and suitable for industrial production; has low production cost; utilizes graphene and dielectric substrate, which are uniformly composited without air gaps; and does not required binder and metal addition during preparation process; The graphene PCB: has excellent electrical performance, high heat dissipation and corrosion resistance; has stable and uniform dielectric constant; and is light weight. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for graphene PCB, obtained by above mentioned method.