▎ 摘　　要

NOVELTY - Porous polymer pressure-sensitive film is claimed. The porous polymer pressure-sensitive film comprises filling particles, ionic liquids, polymers and organic solvents. Preparation of porous polymer pressure-sensitive film comprises dispersing filling particles, ionic liquids and organic solvents in polymers. The mass ratio of the polymer to the filler particles is 100:0.01-95; the mass ratio of the polymer to the ionic liquid is 100:0.5-150; the porosity of the pores in the polymer is polymer volume:pore volume is 100:5-300. USE - Porous polymer pressure-sensitive film is useful in piezoresistive pressure sensors, stress sensors, strain sensors, tactile sensors, array pressure sensors, array stress sensors, and array strain sensors (all claimed). ADVANTAGE - The porous polymer pressure-sensitive film is prepared by solution synthesis, in situ synthesis phase, simple method. The porous polymer pressure-sensitive film: hydrophobic performance, high efficiency of contact filler, keeping the ductility of the flexible pressure material, and improving the sensitivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included preparing porous polymer pressure-sensitive film comprising (i) weighing each component to the mass ratio, dissolving the polymer in an organic solvent in mass ratio 1:1-50, stirring to completely dissolve the polymer to obtain a uniform and clear polymer solution, adding ionic liquid to the polymer solution in mass ratio 100:0.5-150, stirring and mixing evenly to obtain solution H, (ii) uniformly mix the filler particles with the organic solvent in mass ratio 1:1-100, mixing and stirring evenly to obtain a solution K, (iii) mixing the solution H obtained in step (i) and the solution K obtained in step (ii) in mixing volume ratio 1:0.01-10 and mixing evenly to obtain the precursor solution L and (iv) transferring the precursor solution L obtained in (iii) to the substrate or the mold to uniformly disperse the precursor solution L on the substrate or the mold, where the thickness of the precursor solution L in the substrate or the mold is 100 nm to 6 cm, treating substrate or the mold coated with the precursor solution L to remove the organic solvent to obtain final product.