▎ 摘　　要

NOVELTY - The anti-spill fence has an inner core, a bonding glue and an outer packaging material. The inner core is selected from one of foam, sponge and foamed silica gel. The inner core is foamed silica gel, and the foamed silica gel is high-density foamed silica gel. The adhesive is a high temperature resistant double-sided adhesive tape without substrate. The external packaging material is selected from one of graphite sheets, graphene sheets, graphene or silica composite, graphene or carbon black composite, graphene or carbon nanotube composite and graphene oxide. USE - Anti-overflow fence of heat-conducting material used in semiconductor device. ADVANTAGE - The heat-conducting material anti-overflow fence has very good rebound resilience, and can keep the state of the firm when it is used for a long time, fully contact the radiator and the chip, prevents the liquid metal from overflowing after being heated and liquefied, and also has a certain heat conducting performance, it can better help chip radiating. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a use method of the heat-conducting material anti-overflow fence with heat-conducting function.