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  • 专利标题:   Conductive high-temperature-resistant polyimide composite adhesive film, prepared by using coupling agent to pretreating conductive foam, fixing conductive foam on surfaces of ultra-thin fabric, and immersing in high-temperature-resistant polyimide resin adhesive solution.
  • 专利号:   CN115366492-A, CN115366492-B
  • 发明人:   ZHANG H, LI L, WANG G, XIN Y, XU X, YIN X, WANG D, KE H, LI N
  • 专利权人:   AEROSPACE RES INST SPECIAL MATERIALS, AEROSPACE RES INST SPECIAL MATERIALS P
  • 国际专利分类:   B32B015/02, B32B015/14, B32B027/12, B32B027/42, B32B037/10, B32B037/12, B32B038/08, B32B005/02, B32B007/12, B32B009/00, B32B009/04
  • 专利详细信息:   CN115366492-A 22 Nov 2022 B32B-005/02 202306 Chinese
  • 申请详细信息:   CN115366492-A CN10534645 17 May 2021
  • 优先权号:   CN10534645

▎ 摘　　要

NOVELTY - Conductive high-temperature-resistant polyimide composite adhesive film comprises three-dimensional sandwich structure formed by bonding conductive foam and ultra-thin fabric, and impregnating a high-temperature-resistant polyimide resin with the three-dimensional sandwich structure; where the high-temperature-resistant polyimide resin contains nano conductive chopped fibers. USE - Used as conductive high-temperature-resistant polyimide composite adhesive film. ADVANTAGE - The method: improves the electrical conductivity of the adhesive film. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing conductive high-temperature-resistant polyimide composite adhesive film, comprising (i) using coupling agent to pretreating conductive foam, (ii) fixing the conductive foam on upper and lower surfaces of ultra-thin fabric through high-temperature-resistant polyimide resin adhesive to obtain composite conductive fabric prefabricated body, and (iii) immersing the composite conductive fabric prefabricated body in high-temperature-resistant polyimide resin adhesive solution to obtain final product.