• 专利标题:   Preparation of low dielectric constant polymer/fluorinated graphene composite material by placing graphene in reactor, introducing fluorine gas, heating, dispersing by mixing with polyamide or epoxy resin solution, molding, and heating.
  • 专利号:   CN103772981-A, CN103772981-B
  • 发明人:   FAN C, GAO J, LI B, LIU X, REN M, WANG X, WU P
  • 专利权人:   UNIV SICHUAN
  • 国际专利分类:   C08G073/10, C08K003/04, C08K009/02, C08L063/00, C08L079/08
  • 专利详细信息:   CN103772981-A 07 May 2014 C08L-079/08 201444 Pages: 9 Chinese
  • 申请详细信息:   CN103772981-A CN10745175 30 Dec 2013
  • 优先权号:   CN10745175

▎ 摘  要

NOVELTY - Preparation of a low dielectric constant polymer/fluorinated graphene composite material comprises mixing graphene or its derivative in a reactor, introducing fluorine gas at 10-100 KPa at room temperature, heating to 150-300 degrees C, heat-preserving for 0.5-4 hours, and cooling to room temperature to obtain a fluorinated graphene; dispersing fluorinated graphene by mixing with 0.3-5 mass% polyamide or epoxy resin solution; and pouring the mix solution in a mold, vacuumizing for 0.5-5 hours at 40-90 degrees C, initial curing at 100-160 degrees C for 0.5-5 hours, and heating to 170-350 degrees C for 0.5-5 hours. USE - Method for the preparation of a low dielectric constant polymer/fluorinated graphene composite material (claimed). ADVANTAGE - The method is simple and inexpensive, and has improved mechanical property and heat stability. DETAILED DESCRIPTION - Preparation of a low dielectric constant polymer/fluorinated graphene composite material comprises: (A) mixing graphene or its derivative in a reactor, introducing fluorine gas in the reactor at 10-100 KPa at room temperature and inert atmosphere, heating to 150-300 degrees C, heat-preserving for 0.5-4 hours, and cooling to room temperature to obtain a fluorinated graphene; (B) dispersing fluorinated graphene by mixing with 0.3-5 mass% polyamide or epoxy resin solution; and (C) pouring the mix solution in a mold, vacuumizing for 0.5-5 hours to remove solvent at 40-90 degrees C, initial curing at 100-160 degrees C for 0.5-5 hours, and heating to 170-350 degrees C for 0.5-5 hours.