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专利标题: Heat dissipating material used for electronic device, contains alumina ceramic powder, paraffin powder, graphene, graphite fiber, silicone carbide, polycarbonate, polylactic acid, maleic anhydride-grafted polypropylene and isoprene.
专利号: CN108864639-A
发明人: QIN H
专利权人: QIN H
国际专利分类: C08L051/06, C08L091/06, C08L069/00, C08L067/04, C08L009/00, C08L033/12, C08K003/22, C08K003/04, C08K007/06, C08K003/34, C08K013/04
专利详细信息: CN108864639-A 23 Nov 2018 C08L-051/06 201907 Pages: 5 Chinese
申请详细信息: CN108864639-A CN10900964 09 Aug 2018
优先权号: CN10900964

▎ 摘　　要

NOVELTY - Heat dissipating material comprises alumina ceramic powder, paraffin powder, graphene, graphite fiber, silicone carbide, tributyloxyethyl phosphate, polycarbonate, polylactic acid, sodium tetrapolyphosphate, isoprene, chloropropyl styrene, maleic anhydride-grafted polypropylene, methyl methacrylate and additive. USE - Heat dissipating material for electronic device. ADVANTAGE - The heat dissipating material has enhanced heat dissipation performance.