▎ 摘　　要

NOVELTY - Optimized filling holes comprise providing a copper-clad substrate including a prepreg layer overlaid with a copper foil and a first dry film laminated on the copper foil, in which a blind hole with an insulative inner wall is formed at a predetermined position and defines an upper opening. The first dry film is patterned corresponding to the upper opening and insoluble in a non-alkaline solution. The insulative inner wall of the blind hole is modified with reduced graphene oxide. Copper is deposited in the blind hole through an electroplating process, The first dry film is removed to expose the copper foil. The exposed copper foil is also removed. USE - Method for optimized filling holes on a printed circuit board. ADVANTAGE - The method adopts independently considered operating parameters to get uniformly compact copper-plating fillings and fine lines having square profiles without using traditional metallization processes such as chemical copper.