• 专利标题:   Deformable yet mechanically resilient microcapsules used in circuit component, comprises gallium liquid metal alloy core and at least one alloying metal, and polymeric shell encapsulating the liquid core.
  • 专利号:   US11387013-B1
  • 发明人:   TABOR C, CUMBY B L
  • 专利权人:   US SEC AIR FORCE
  • 国际专利分类:   B01J013/08, H01B001/02, H01B001/22, H01B013/00, H01B005/00
  • 专利详细信息:   US11387013-B1 12 Jul 2022 H01B-005/00 202266 English
  • 申请详细信息:   US11387013-B1 US991222 12 Aug 2020
  • 优先权号:   US510629P, US991222

▎ 摘  要

NOVELTY - Deformable yet mechanically resilient microcapsule comprises a gallium liquid metal alloy core having 60-100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core. The polymeric shell has conductive properties. The polymeric shell comprises a coating of an electrically conductive material and/or incorporating an electrically conductive material selected from silver particles, gold particles, copper particles, gallium particles, indium particles, gallium/indium alloy particles, mercury particles, aluminum particles, polythiophene, poly(ethylenedioxythiophene), polyaniline, graphene, carbon nanotubes, fullerenes, and mixtures. USE - Deformable yet mechanically resilient microcapsules used in circuit component. ADVANTAGE - The deformable yet mechanically resilient microcapsule has electrical properties. The polymeric shell is elastic that provides mechanical resiliency and also forms a protective layer against conducive fluid coalescence.