▎ 摘　　要

NOVELTY - The module (1) has three layers stacked one on top of the other. A heat sink (10) is provided with an upper side (12). An electrically insulating intermediate layer (20) is arranged on the top side of the heat sink and extending over a large area with a first side (21) facing the top side of the heat sink and one from the first side facing away from the second side (22). A cover layer (30) is arranged on the second side of the intermediate layer with a contact side (31) facing the second side of the intermediate layer and an upper side (32) of the cover layer facing away from the contact side of the cover layer. An electrical and electronic power component (40) is arranged on the top of the cover layer. The cover layer is partially made of graphene. USE - Power module used as portion of inverter or converter in automotive engineering and used in inverter for operating electrical machine of hybrid or electric vehicle. ADVANTAGE - The structures for improving the heat dissipation are formed. The silicon carbide semiconductors potentially have more power loss in a smaller space. The more heat is dissipated to the heat sink in the direction perpendicular to the second side of the intermediate layer when a ceramic with high thermal conductivity such as aluminum nitride (AlN) is used as the intermediate layer. The circuit carrier area required for the power component, which is embodied as a semiconductor, is significantly reduced. The overall system costs are advantageously reduced in spite of the higher costs for the intermediate layer embodied as ceramic. The switching frequency of the power component is advantageously increased by the intermediate layer formed from aluminum nitride. The heat generated in the power component is advantageously dissipated well to the heat sink through the ceramic material with high thermal conductivity. The graphene in the cover layer is advantageously connected to the intermediate layer with good thermal conductivity. The heat generated in the power component is advantageously dissipated well to the intermediate layer and to the heat sink. The heat dissipation below the power component is advantageously optimized. The technology enables the implementation of power modules with a higher power density through system-optimized heat flow management. The power module enables the implementation of power modules with a higher power density through system-optimized heat flow management. The heat is transferred from the power component through the cover layer with graphene to the intermediate layer and so that layer is diverted to the heat sink, since graphene as a monoatomic carbon layer shows an extremely high thermal conductivity in the plane, which at up to 3000 W / mK is still above the value of copper, in the power module. The stability against thermal fluctuations increases due to the flexibility of graphene. The power module represents an advantageous heat flow-optimized power module with high power density and robustness. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the power module. Power module (1) Heat sink (10) Upper side (12) Electrically insulating intermediate layer (20) First side (21) Second side (22) Cover layer (30) Contact side (31) Upper side of cover layer (32) Electrical and electronic power component (40)