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  • 专利标题:   Hybrid bonding structure for use in semiconductor device, comprises core and shell configured to form intermetallic compound in response to transient liquid phase.
  • 专利号:   US2022093549-A1, KR2022040307-A, CN114256184-A, EP3974096-A1
  • 发明人:   LEE J, SONG B, CHU K, CHU K M, JUNGHOON L, LI Z, JOO G
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   H01L023/00, H01L023/492, H01L023/498, B22F001/17, B23K101/40, B23K003/08, H01L021/60, H01L023/488, B23K020/02, B23K020/233, B23K035/02, B23K035/22, B23K035/26, B23K035/30
  • 专利详细信息:   US2022093549-A1 24 Mar 2022 H01L-023/00 202232 English
  • 申请详细信息:   US2022093549-A1 US477806 17 Sep 2021
  • 优先权号:   KR123317

▎ 摘　　要

NOVELTY - Hybrid bonding structure comprises a solder ball, and a solder paste bonded to the solder ball, where the solder paste includes a transient liquid phase (132). The transient liquid phase includes a core (134) and a shell (136) on a surface of the core, where a melting point of the shell is lower than a melting point of the core. The core and the shell are configured to form an intermetallic compound in response to the transient liquid phase partially being at a temperature that is within a temperature range of 20-190degrees Celsius. USE - Hybrid bonding structure for use in semiconductor device (claimed). ADVANTAGE - The hybrid bonding structure has improved mechanical properties at the bonding boundary area, and reduces the deformation of a semiconductor package due to a high temperature. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) a semiconductor device, which comprises a circuit board, a semiconductor chip, and a hybrid bonding structure between the circuit board and the semiconductor chip, where the hybrid bonding structure including a solder ball, and a solder paste bonded to the solder ball; (2) a method for manufacturing semiconductor device, which comprises forming a semiconductor chip, arranging a solder ball on the semiconductor chip, applying a solder paste to a circuit board, positioning the solder ball to face the solder paste, melting the shell at 20-190degrees Celsius to form an intermetallic compound between the shell and the core, and bonding the semiconductor chip to the circuit board; and (3) a solder paste composition, which comprises a core, and a shell on a surface of the core, where the melting point of the shell is lower than a melting point of the core, and the core and the shell are configured to form an intermetallic compound in response to the solder paste composition. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic enlarged view of the transient liquid phase of a semiconductor device. Transient liquid phase (132) Core (134) Surface (134S) Shell (136) Insertion layer (138)