▎ 摘　　要

NOVELTY - Isotropous high-property heat conduction adhesive filled with graphene comprises (pts.wt.): epoxy resin (100), curing agent (10-15), curing catalyst (2-3), graphene (5-10), diluting agent (40-50) and thixotropic agent (2-3). USE - An isotropous high-property heat conduction adhesive filled with graphene used in liquid crystal device. ADVANTAGE - The adhesive overcomes the defects of low heat conduction and low adhesive intensity of the heat conduction adhesive. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the adhesive comprising: (A) mechanically mixing the epoxy resin and the thixotropic agent at 1000 revolutions/minute (rpm) for 10 minutes; (B) orderly adding the graphene and the diluting agent in the mixing state; continuously stirring for 10 minutes after finishing adding; (C) adding the curing agent and the curing catalyst after uniformly mixing; (D) turning the mixture into a high-speed cutting mixer to mix after mechanically mixing for 5 minutes, where the mixing speed is 2000 rpm; the time is 30 seconds; and (E) repeating the mixing process in the high-speed cutting mixer for 3 times to obtain the uniformly mixed glue material as the heat conduction adhesive.