▎ 摘　　要

NOVELTY - Heat dissipation adhesive sheet comprises heat dissipation layer (10), at least one metal thin film layer (20) formed on the lower surface of the heat dissipation layer, and adhesive layer (30) formed on the lower surface of the metal thin film layer. The heat dissipation layer comprises 70-85 wt.% binder resin based on the total weight of the composition forming the heat dissipation layer, 12-25 wt.% thermally conductive particles, and 3-10 wt.% additives. The binder resin contains a urethane resin or an epoxy resin. The thermally conductive particles include expanded graphite particles and metal particles. The expanded graphite particles are milled for 2-5 hours to separate graphene nanoplates (GNPs) and graphene from graphite. At least two of graphene nanoplate particles and graphene particles are mixed, and the expanded graphite particle diameter is 0.1-50 μ m. USE - The heat dissipation adhesive sheet is useful in electronic components e.g. semiconductors, panel displays or PC boards, air conditioning parts, batteries, fuel cells, battery cases, chargers, wireless chargers, and LED lights. ADVANTAGE - The heat dissipation adhesive sheet: improves efficiency and performance of electronic components; is easy to use; quickly diffuses heat to a wide area to lower the temperature, and is able to quickly and conveniently cool the base material that requires heat dissipation. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of heat dissipation adhesive sheet. 10Heat dissipation layer 20Metal thin film layer 30Adhesive layer