▎ 摘　　要

NOVELTY - The method involves pre-coating or depositing graphene at an interface of copper and aluminum. Combining process of the copper, the aluminum and the graphene is performed. Graphene coating and plating processes are performed for chemical vapor deposition, where the graphene includes powder or film. A rod wire, a plate, a strip and a foil are formed on the interface by using copper-aluminum composite material. A surface of the graphene is distributed with metal particles. USE - Copper-aluminum composite material interface bonding and electrical conductivity increasing method. ADVANTAGE - The method enables generating brittleness between barrier interfaces by interfacial bonding, reducing conductivity problem of metal compound, and improving bonding and electrical conductivity of the interface.