▎ 摘　　要

NOVELTY - The method involves (i) providing a substrate, and forming a graphene layer on an upper surface of the substrate; (ii) forming a functional material layer on the upper surface of the graphene layer; (iii) forming a rigid temporary substrate layer on the upper surface of the graphene layer; (iv) forming a temporary bonding glue layer on the surface of the rigid temporary substrate layer; (v) bonding the rigid temporary substrate layer with the functional material layer; and (vi) transferring the laminated structure to a target substrate, removing the rigid temporary substrate layer, and leaving the functional material layer on the surface of the target substrate. USE - Method for integrating of thin film material. ADVANTAGE - The method uses rigid temporary substrate, which is good for reducing the deformation of the functional material layer in the process, realizing the wafer level alignment integration with the target substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the method of claim. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating the method for integrating of thin film material (Drawing includes non-English language text).