• 专利标题:   Isotropy high-performance conductive adhesive used for electronic encapsulation, comprises base epoxy resin, core-shell toughening epoxy resin, graphene, curing agent, curing accelerator, and fumed silica.
  • 专利号:   CN102382606-A, CN102382606-B
  • 发明人:   WU H, LI B, TAO X, TAO Y, XIA Y, TAO G
  • 专利权人:   UNIV CHANGZHOU, CHANGZHOU HERUN NEW MATERIAL SCI TECHN
  • 国际专利分类:   C09J011/04, C09J163/00, C09J009/02
  • 专利详细信息:   CN102382606-A 21 Mar 2012 C09J-163/00 201226 Pages: 7 Chinese
  • 申请详细信息:   CN102382606-A CN10277179 19 Sep 2011
  • 优先权号:   CN10277179

▎ 摘  要

NOVELTY - An isotropy high-performance conductive adhesive comprises (pts.wt.) base epoxy resin (100), core-shell toughening epoxy resin (50-60), graphene (15-20), curing agent (1-15), curing accelerator (2-3), and fumed silica (2-3). USE - An isotropy high-performance conductive adhesive used for electronic encapsulation. ADVANTAGE - The graphene has an increased dispersing degree in the conductive adhesive. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the isotropy high-performance conductive adhesive, comprising: (A) mixing base epoxy resin and core-shell toughening epoxy resin at 100 revolutions/minute (rpm) for 10 minutes; (B) adding processed graphene and fumed silica in agitating state, and agitating for 10 minutes; and (C) adding curing agent and curing accelerator, mechanically agitating for 5 minutes, transferring to a high-speed shear mixer to mix at 2000 rpm for 30 seconds, and repeating the mixing processes in the high-speed shear mixer for 3 times.