▎ 摘　　要

NOVELTY - A dynamic grating comprises semiconductor substrate (1), adhesive layer, electrode layer (2), calcium fluoride dielectric layer (3) and single-layer graphene (4) arranged sequentially from bottom to top. The electrode layer is adhered to the semiconducting substrate through the adhesive layer and is a metal film with an interdigital electrode structure. USE - Dynamic grating for preparing plasmonic emitters, beam splitters, modulators and sensors (all claimed). ADVANTAGE - The duty ratio and height of the dynamic grating can be dynamically adjusted by adjusting the voltage of the external power supply. The method is simple and economical. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: Preparation of dynamic grating, which involves cleaning semiconductor substrate with deionized water, immersing the semiconductor substrate in an acetone solution, performing ultrasonic treatment of the semiconductor substrate for multiple times using an ultrasonic machine, taking the semiconductor substrate out of the acetone solution, performing ultrasonic treatment of the semiconductor substrate with the deionized water, placing the semiconductor substrate in a solution prepared from concentrated sulfuric acid and hydrogen peroxide for heating in a water bath, taking the semiconductor substrate out, performing ultrasonic treatment of the semiconductor substrate subjected to the water bath with the deionized water, and drying the semiconductor substrate using nitrogen, uniformly spin-coating a layer of photoresist on the surface of the semiconductor substrate by using a spin coater to obtain a photoresist layer, placing the semiconductor substrate coated with the photoresist on a heating table for heating, exposing the photoresist layer by using an electron beam lithography method according to a preset interdigital electrode pattern, and developing the exposed photoresist layer by using a developing solution to obtain a photoresist template using an interdigital electrode structure, plating an adhesive layer on the surface of the photoresist template by using an electron beam evaporation coating machine, plating a metal film on the surface of the adhesion layer, taking the semiconductor substrate, placing the sample in a beaker filled with an acetone solution for heating in a water bath, slightly shaking the beaker, removing the photoresist on the sample to obtain an electrode layer of an interdigital electrode structure, plating a layer of calcium fluoride on the surface of the electrode layer by using an electron beam evaporation plating machine as calcium fluoride dielectric layer and transferring the single-layer graphene on the surface of the calcium fluoride dielectric layer by using a wet transfer method; and Use of the dynamic grating. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the dynamic grating. 1Semiconductor substrate 2Electrode layer 3Calcium fluoride dielectric layer 4Single-layer graphene