• 专利标题:   Preparation of high thermal conductivity graphene film, involves placing substrate with oxidized graphene film in aqueous solution containing reducing agent to reduce graphene film surface, separating from substrate, and heat treating.
  • 专利号:   CN105860939-A, CN105860939-B
  • 发明人:   LIU J
  • 专利权人:   SHANGHAI SHANGDA RUIHUI MICROSYSTEM INTE, SHENZHEN SHENRUI GRAPHENE TECHNOLOGY CO
  • 国际专利分类:   C01B031/04, C09K005/14, C01B032/184
  • 专利详细信息:   CN105860939-A 17 Aug 2016 C09K-005/14 201668 Pages: 9 Chinese
  • 申请详细信息:   CN105860939-A CN10191785 30 Mar 2016
  • 优先权号:   CN10191785

▎ 摘  要

NOVELTY - The preparation of graphene film involves (1) preparing oxidized graphene solution, applying graphene solution to the surface of auxiliary substrate, (2) evaporating graphene solution to obtain oxidized graphene film, (3) placing auxiliary substrate with oxidized graphene film in aqueous solution containing reducing agent to reduce the surface of graphene film, separating film from substrate, (4) heat treating separated film for complete reduction, and (5) rolling the reduced graphene film to increase density. USE - Preparation of high thermal conductivity graphene film (claimed). ADVANTAGE - The method enables preparation of high thermal conductivity graphene film having excellent flexibility, mechanical strength, and thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for heat dissipation method, which involves preparing aminated silane molecular functional layer comprising a first portion and a second portion, where first portion comprises activator and an oxidized graphene mixed with activated graphene oxide solution, and second portion comprises 10-60 vol.% aminosilane ethanol solution, applying first portion onto the surface of highly thermally conductive graphene film, applying the second portion to a surface of the application substrate, evaporating solvent in the second portion of the surface, inverting first portion to the surface of application substrate to which the second portion is applied, and curing.