▎ 摘　　要

NOVELTY - A microelectronic package (100) comprises a die (105); and a package substrate (110) which is coupled to the die with a first interconnect (115, 120, 125) on a first face and comprises a second interconnect and a third interconnect on a second face opposite to the first face, a conductive signal path (135) between the first interconnect and second interconnect, a conductive ground path (140) between the second interconnect and third interconnect, and electrostatic discharge (ESD) protection material (145) coupled to conductive ground path, where the ESD protection material comprises a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and electrically-conductive polymer that is chemically bonded to the first functional group and second functional group permitting electrical signal (130) to pass between first and second electrically-conductive carbon allotropes. USE - A microelectronic package used for electrical device e.g., handheld or mobile electrical device (e.g., a cell phone, a smartphone, a mobile internet device, a music player, a tablet computer, a laptop computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultra mobile personal computer, etc.), a desktop electrical device, a server device or other networked computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a vehicle control unit, a digital camera, a digital video recorder, or a wearable electrical device. ADVANTAGE - Selective and direction functionalization via grafting may improve electron transport in the composite when the voltage (e.g., the ESD) has reached a triggered voltage. Intrinsically-conductive polymers may be reversibly doped/dedoped to transition from a conductive state to a non-conductive state, which may allow for specific tuning of the ESD voltage range. The choice of intrinsically-conductive polymers may lower the trigger-voltage, while two-dimensional materials such as the carbon allotropes may improve conduction pathways at a lower percolation threshold. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) package substrate (110) comprising a set of conductive elements in a set of layers of dielectric material; a first interconnect (115, 120, 125) on a first face; a second interconnect and a third interconnect on a second face opposite to the first face; and an ESD protection material (145) embedded in the dielectric material, where the ESD protection material comprises a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer that is chemically bonded to the first functional group and the second functional group permitting an electrical signal (130) to pass between the first and second electrically-conductive carbon allotropes, a first set of the set of conductive elements provides a signal path between the first interconnect and the second interconnect, a second set of the set of conductive elements provides a ground path (140) between the second interconnect and the third interconnect, and the ESD protection material is coupled to the second set of the set of conductive elements; and (2) method for providing ESD protection in a microelectronic package which involves providing a signal path in a package substrate of the microelectronic package electrically coupling a die to the package substrate; providing a conductive ground path in the package substrate electrically coupled to the signal path; providing an ESD protection material coupled to the conductive ground path, the ESD protection material comprising a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer that chemically bonds with the first functional group and the second functional group such that the first and second electrically-conductive carbon allotropes are chemically bonded to one another within a non-conductive material; and providing a voltage differential across the signal path, where the ESD protection material is an insulator if the voltage differential is less than a voltage threshold, and the ESD protection material is a conductor if the voltage differential is greater than the voltage threshold. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the microelectronic package with an ESD protection material. Package (100) Die (105) Package substrate (110) Interconnect (115, 120, 125) Electrical signal (130) Signal path (135) Ground path (140) ESD protection material (145)