▎ 摘　　要

NOVELTY - Electroplating method, comprises forming the conductive paste into a conductive circuit, pretreating the conductive circuit, and performing electroplating metal treatment on the conductive circuit, where the pretreatment specifically includes soaking the conductive circuit in nitric acid, the concentration of the nitric acid is 2-10%, and the soaking time is 1-4 minutes. The conductive filler in the conductive paste comprises gallium, indium, tin, zinc, bismuth, gold, silver, iron, nickel, aluminum, graphene, and/or silver-coated copper powder. The conductive paste is used to form the conductive lines on the base material. The base material is polyimide film or polyethylene terephthalate film. The metal comprises copper, silver, nickel, tin and/or gold. USE - Electroplating method for improving adhesive attraction of conductive circuit and surface coating. ADVANTAGE - The method optimizes the electroplating process, namely, effectively improves the adhesive force of the conductive circuit and the surface coating layer, and effectively improving the adhesion between the substrate and the substrate; and when the base material is polyimide film or polyethylene terephthalate film. The method can effectively improve the adhesive attraction of conductive circuits and surface coating. The pre-processed circuit has strong bonding force with the plating metal layer; and after the specific concentration of nitric acid after soaking, not only has strong adhesion with the metal plating layer, but also improves the bonding force between the surface of the metal layer and the circuit bonding force to further improve the adhesiveness of the circuit with the surface metal layer.