▎ 摘　　要

NOVELTY - A heat sink material is obtained by alternately bonding a copper film layer and a graphene layer. The copper film layer and graphene layer are 3 layers, respectively. USE - Heat sink material is used for electronic device and micro-nano power device. ADVANTAGE - The heat sink material has excellent thermal conductivity due to the presence of graphene and processability, and can be manufactured by directly growing graphene on the copper film layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of heat sink material.