国家/地区 China(45) Usa(3)
关键词 THERMAL INTERFACE M.(11) GRAPHENE(10) THERMAL CONDUCTIVIT.(10)
GRAPHENE PAPER(4) THERMAL PROPERTIE(4) ELECTRICAL PROPERTI.(3)
HIERARCHICAL STRUCT.(3) VERTICALLY ALIGNED .(3) COMPOSITE(2)
COPPER MATRIX COMPO.(2) ELECTROMAGNETIC INT.(2) EPOXY COMPOSITE(2)
GRAPHENE NANOPLATEL.(2) GRAPHENE NANOSHEET(2) HYBRID(2)
出版物 ACS NANO(5) JOURNAL OF MATERIAL.(4) RSC ADVANCES(4)
CHINESE CHEMICAL LE.(3) COMPOSITES COMMUNIC.(3) ADVANCED FUNCTIONAL.(2)
CARBON(2) CHEMICAL ENGINEERIN.(2) COMPOSITES PART AAP.(2)
MATERIALS DESIGN(2) MATERIALS SCIENCE .(2) NANOMATERIALS(2)
NANOSCALE(2) POLYMERS(2)
出版时间 2021(11) 2022(9) 2020(6) 2014(5) 2015(5) 2016(4) 2018(4) 2017(3) 2019(3) 2023(2)
机构 CHINESE ACAD.(18) CHANGZHOU UN.(4) KUNMING UNIV.(3)
作者 DAI W(52)

CHINESE CHEMICAL LETTERS

YE C, ZHANG F, TAN X, SUN HF, DAI W, YANG K, YANG MH, DU SY, DAI D, YU JH, JIANG N, SU WT, FU L, LI H, KONG J, LIN CT

MATERIALS SCIENCE ENGINEERING CMATERIALS FOR BIOLOGICAL APPLICATIONS

SHENG YS, DAI W, GAO J, LI HD, TAN WS, WANG JW, DENG LH, KONG Y

JOURNAL OF MATERIALS CHEMISTRY A

SUN HY, YE C, ZHAO G, ZHANG H, LIU ZD, DAI W, WANG JJ, ALAM FE, YAN QW, LI XM, XU J, CHEN CY, ZHAO P, YE JC, JIANG N, CHEN D, WU SD, KONG J, LIN CT

MATERIALS SCIENCE ENGINEERING CMATERIALS FOR BIOLOGICAL APPLICATIONS

YUN YJ, WU HW, GAO J, DAI W, DENG LH, LV O, KONG Y

CHEMICAL ENGINEERING JOURNAL

CHEN YP, HOU X, LIAO MZ, DAI W, WANG ZW, YAN C, LI H, LIN CT, JIANG N, YU JH

CHINESE CHEMICAL LETTERS

ZHANG F, YE C, DAI W, LV L, YUAN QL, CHEE KWA, YANG K, JIANG N, LIN CT, ZHAN ZL, DAI D, LI H

NANOSCALE

LIU ZD, CHEN YP, LI YF, DAI W, YAN QW, ALAM FE, DU SY, WANG ZW, NISHIMURA K, JIANG N, LIN CT, YU JH

ACS NANO

DAI W, MA TF, YAN QW, GAO JY, TAN X, LV L, HOU H, WEI QP, YU JH, WU JB, YAO YG, DU SY, SUN R, JIANG N, WANG Y, KONG J, WONG CP, MARUYAMA S, LIN CT

ACS NANO

DAI W, LV L, LU JB, HOU H, YAN QW, ALAM FE, LI YF, ZENG XL, YU JH, WEI QP, XU XF, WU JB, JIANG N, DU SY, SUN R, XU JB, WONG CP, LIN CT

JOURNAL OF MATERIALS CHEMISTRY C

CHEN YP, HOU X, KANG RY, LIANG Y, GUO LC, DAI W, NISHIMURA K, LIN CT, JIANG N, YU JH