国家/地区 China（16）
关键词 COMPOSITE SOLDER（4） GRAPHENE（4） AGGNS（2）
BALL MILLING METHOD（2） MECHANICAL PROPERTI.（2） NANOINDENTATION（2）
OXYGEN REDUCTION RE.（2）
出版物 MATERIALS SCIENCE E.（5） JOURNAL OF ALLOYS C.（2）
出版时间 2017（3） 2015（2） 2019（2） 2020（2） 2021（2）
机构 TIANJIN UNIV（10） DALIAN UNIV .（3）
作者 JING HY（16）

Selective laser melting of low-content graphene nanoplatelets reinforced 316L austenitic stainless steel matrix: Strength enhancement without affecting ductility

ADDITIVE MANUFACTURING

HAN YD, ZHANG YK, JING HY, LIN DY, ZHAO L, XU LY, XIN P

A modified constitutive model of Ag nanoparticle-modified graphene/Sn-Ag-Cu/Cu solder joints

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

HAN YD, GAO Y, JING HY, WEI J, ZHAO L, XU LY

Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

HAN YD, GAO Y, ZHANG ST, JING HY, WEI J, ZHAO L, XU LY

Biomass-Derived Multilayer-Graphene-Encapsulated Cobalt Nanoparticles as Efficient Electrocatalyst for Versatile Renewable Energy Applications

ACS SUSTAINABLE CHEMISTRY ENGINEERING

WU DY, ZHU C, SHI YT, JING HY, HU JW, SONG XD, SI DH, LIANG SX, HAO C

Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

JOURNAL OF ELECTRONIC MATERIALS

XU LY, ZHANG ST, JING HY, WANG LX, WEI J, KONG XC, HAN YD

Ag-graphene hybrid conductive ink for writing electronics

NANOTECHNOLOGY

XU LY, YANG GY, JING HY, WEI J, HAN YD

Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

LIU XD, HAN YD, JING HY, WEI J, XU LY

Co3O4 nanoparticles assembled on polypyrrole/graphene oxide for electrochemical reduction of oxygen in alkaline media

CHINESE JOURNAL OF CATALYSIS

REN SZ, GUO YN, MA SB, MAO Q, WU DD, YANG Y, JING HY, SONG XD, HAO C

Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers

JOURNAL OF ALLOYS COMPOUNDS

JING HY, GUO HJ, WANG LX, WEI J, XU LY, HAN YD

Ozonization, Amination and Photoreduction of Graphene Oxide for Triiodide Reduction Reaction: An Experimental and Theoretical Study

ELECTROCHIMICA ACTA

JING HY, REN SZ, SHI YT, SONG XD, YANG Y, GUO YN, AN YL, HAO C