MATERIALS LETTERS

LI MW, YANG SB

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

WANG JQ, ZHAO SL, LI MW, WANG PC, LI MH

JOURNAL OF APPLIED POLYMER SCIENCE

SONG GP, HE SF, HE F, YAO YT, LI JJ, LI MW, HE XD

SENSORS

LI MW, ZHANG T, WANG PC, LI MH, WANG JQ, LIU ZW

APPLIED PHYSICS LETTERS

LI MW, WU CG, ZHAO SL, DENG T, WANG JQ, LIU ZW, WANG L, WANG G

CHEMICAL PHYSICS LETTERS

SUN SA, WANG CY, CHEN MM, LI MW

PHYSICAL CHEMISTRY CHEMICAL PHYSICS

YIN KL, SHI LP, ZHONG YS, MA XL, LI MW, HE XD

ACTA PHYSICOCHIMICA SINICA

SHANG NZ, CHENG Y, AO S, TUERDI G, LI MW, WANG XY, HONG H, LI ZH, ZHANG XY, FU WY, LIU KH, LIU ZF

ACS PHOTONICS

CHENG Y, YU WT, XIE J, WANG RY, CUI G, CHENG X, LI MW, WANG K, LI JL, SUN ZP, CHEN K, LIU KH, LIU ZF

IEEE SENSORS JOURNAL

ZHU Z, WANG JQ, WU CY, CHEN XW, LIU XF, LI MW