EXPERIMENTAL THERMAL FLUID SCIENCE

WU CH, LEE YA, LAI YJ, SHIEH J, YANG CR, HSU CC

ACTA CRYSTALLOGRAPHICA SECTION CSTRUCTURAL CHEMISTRY

HUANG RT, WU CH, HUANG SS, CHEN DY, ZHANG Q, WANG Q, HU ZJ, JIANG Y, ZHAO B, CHEN ZW

ELECTROCHIMICA ACTA

DENG SX, SUN D, WU CH, WANG H, LIU JB, SUN YX, YAN H

CHEMICAL ENGINEERING JOURNAL

WU CH, ZHANG YZ, LI S, ZHENG HJ, WANG H, LIU JB, LI KW, YAN H

ACS APPLIED MATERIALS INTERFACES

VERGUTS K, SCHOUTEDEN K, WU CH, PETERS L, VRANCKEN N, WU XY, LI Z, ERKENS M, PORRET C, HUYGHEBAERT C, VAN HAESENDONCK C, DE GENDT S, BREMS S

COMPOSITES PART BENGINEERING

CHEN CY, PU NW, LIU YM, HUANG SY, WU CH, GER MD, GONG YJ, CHOU YC

EXPERT OPINION ON DRUG DELIVERY

WU CH, ZHU AN, LI D, WANG LH, YANG H, ZENG HJ, LIU YY

JOURNAL OF POWER SOURCES

PU NW, SHI GN, LIU YM, SUN XL, CHANG JK, SUN CL, GER MD, CHEN CY, WANG PC, PENG YY, WU CH, LAWES S

MICROELECTRONIC ENGINEERING

WU CH, PU NW, WU PJ, PENG YY, SHIH CN, CHEN CY, LIU YM, GER MD

ADVANCED MATERIALS

GUO YH, LI ZY, AN N, GUO YZ, WANG YC, YUAN YS, ZHANG H, TAN T, WU CH, PENG B, SOAVI G, RAO YJ, YAO BC