国家/地区 China（2）
关键词
出版物 JOURNAL OF MATERIAL.（2）
出版时间 2021（2）
机构
作者 ZHONG SJ（2）

Microstructure evolution of Cu/Sn58Bi/Cu solder joint bearing graphene nanosheets for 3D packaging

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

JIANG N, ZHANG L, GAO LL, LONG WM, ZHONG SJ, ZHANG L

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid-liquid diffusion and reflowing

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

LI ML, GAO LL, ZHANG L, JIANG N, ZHONG SJ, ZHANG L