| 国家/地区 | China(2) Usa(2) |
| 关键词 |
DIELECTRIC BREAKDOWN(7)
|
| 出版物 | IEEE TRANSACTIONS O.(3) |
| 出版时间 | 2013(2) 2018(2) |
| 机构 | |
| 作者 |
COMPOSITES SCIENCE TECHNOLOGY
CHEN J, LI Y, WANG YF, DONG JF, XU XW, YUAN QB, NIU YJ, WANG Q, WANG H
IEEE TRANSACTIONS ON DIELECTRICS ELECTRICAL INSULATION
DU BX, HAN CL, LI ZL, LI J
JOURNAL OF LOW TEMPERATURE PHYSICS
LAITINEN A, KUMAR M, ELO T, LIU Y, ABHILASH TS, HAKONEN PJ
SOLIDSTATE ELECTRONICS
VAZIRI S, LUPINA G, PAUSSA A, SMITH AD, HENKEL C, LIPPERT G, DABROWSKI J, MEHR W, OSTLING M, LEMME MC
NANO LETTERS
SANGWAN VK, JARIWALA D, FILIPPONE SA, KARMEL HJ, JOHNS JE, ALABOSON JMP, MARKS TJ, LAUHON LJ, HERSAM MC
IEEE TRANSACTIONS ON DIELECTRICS ELECTRICAL INSULATION
WANG ZP, NELSON JK, MIAO JJ, LINHARDT RJ, SCHADLER LS, HILLBORG H, ZHAO S
IEEE TRANSACTIONS ON DIELECTRICS ELECTRICAL INSULATION
DHAR P, KATIYAR A, MAGANTI LS, PATTAMATTA A, DAS SK
