| 国家/地区 |
Singapore(4)
|
| 关键词 |
GOLD(4)
|
| 出版物 | |
| 出版时间 | |
| 机构 | NATL UNIV SI.(2) |
| 作者 |
IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY
ZHU Y, TAN CW, CHUA SL, LIM YD, VAISBAND B, TAY BK, FRIEDMAN EG, TAN CS
ACS APPLIED MATERIALS INTERFACES
WONG CPY, KOEK TJH, LIU YP, LOH KP, GOH KEJ, TROADEC C, NIJHUIS CA
APPLIED PHYSICS LETTERS
SINGH RS, NALLA V, CHEN W, JI W, WEE ATS
PHYSICAL REVIEW B
LU YH, SHI L, ZHANG C, FENG YP
