IEEE ELECTRON DEVICE LETTERS

YU C, HE ZZ, SONG XB, GAO XD, LIU QB, ZHANG YH, YU GH, HAN TT, LIU C, FENG ZH, CAI SJ

JOURNAL OF LIGHTWAVE TECHNOLOGY

FENG Y, LIANG H, YANG TY, LIU C, GONG AN, SHEN T

JOURNAL OF MOLECULAR MODELING

WANG ZJ, SHEN T, FENG Y, LIU C, GONG AN, LIU HC

CHINESE PHYSICS B

WU CC, SHANG NZ, ZHAO ZX, ZHANG ZH, LIANG J, LIU C, ZUO YG, DING MC, WANG JH, HONG H, XIONG J, LIU KH

CHINESE PHYSICS B

CHENG X, ZHOU X, HUANG C, LIU C, MA CJ, HONG H, YU WT, LIU KH, LIU ZF

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

WANG AY, LIU C, HU LX, TIAN T, HE QL, WANG WM, WANG H, FU ZY

ACS APPLIED MATERIALS INTERFACES

LIU C, ZHANG Y, ZHOU QY, DAI YK, ZHANG YL, YANGXIA, LIU J, SUI XL, GU DM, WANG ZB

MATERIALS LETTERS

ZHAO YM, LIU C, HUANG Q

CARBON

LIU C, YIN Q, ZHANG WB, BAO Y, LI PP, HAO LF, MA JZ

COMPOSITES COMMUNICATIONS

LIU C, LI X, LIN Y, XUE X, YUAN QM, ZHANG WB, BAO Y, MA JZ