国家/地区 India（5）
关键词 INTEGRATED CIRCUIT INTERCONNECTION（7）
出版物 IEEE TRANSACTIONS O.（2） MICRO NANO LETTERS（2）
出版时间 2015（2） 2020（2）
机构
作者 SHARMA R（3） KUMAR R（2） ROY S（2）

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Comparative Analysis of the Crosstalk Effects in Multilayer Graphene Nanoribbon and MWCNT Interconnects in Sub-10 nm Technologies

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

HAMEDANI SG, MOAIYERI MH

Modelling and performance analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects

IET CIRCUITS DEVICES SYSTEMS

MEKALA GK, AGRAWAL Y, CHANDEL R

Meshless analysis of bilayer graphene nanoribbon for radio frequency interconnects

MICRO NANO LETTERS

KANTHAMANI S, GAYATHIRI G, ROHINI S

Self-consistent capacitance model for multilayer graphene nanoribbon interconnects

MICRO NANO LETTERS

NISHAD AK, SHARMA R

Demonstration of CMOS-Compatible Multi-Level Graphene Interconnects With Metal Vias

IEEE TRANSACTIONS ON ELECTRON DEVICES

AGASHIWALA K, JIANG JK, PARTO K, ZHANG DJ, YEH CH, BANERJEE K

Comparative Analysis of Prior Knowledge-Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

KUSHWAHA S, SOLEIMANI N, TREVISO F, KUMAR R, TRINCHERO R, CANAVERO FG, ROY S, SHARMA R