国家/地区 India（5）
关键词 INTEGRATED CIRCUIT INTERCONNECTION（5）
出版物 MICRO NANO LETTERS（2）
出版时间 2015（2）
机构
作者 SHARMA R（3） KUMAR R（2） ROY S（2）

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Modelling and performance analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects

IET CIRCUITS DEVICES SYSTEMS

MEKALA GK, AGRAWAL Y, CHANDEL R

Meshless analysis of bilayer graphene nanoribbon for radio frequency interconnects

MICRO NANO LETTERS

KANTHAMANI S, GAYATHIRI G, ROHINI S

Self-consistent capacitance model for multilayer graphene nanoribbon interconnects

MICRO NANO LETTERS

NISHAD AK, SHARMA R

Comparative Analysis of Prior Knowledge-Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

KUSHWAHA S, SOLEIMANI N, TREVISO F, KUMAR R, TRINCHERO R, CANAVERO FG, ROY S, SHARMA R