国家/地区 | China(2) India(2) Usa(2) |
关键词 | METAL(10) |
出版物 | IEEE ELECTRON DEVIC.(2) |
出版时间 | 2023(10) |
机构 | |
作者 |
KUMAR J(2)
MEERSHA A(2)
MISHRA A(2)
SHRIVASTAVA .(2)
VARIAR HB(2) |
IEEE ELECTRON DEVICE LETTERS
MEERSHA A, KUMAR J, MISHRA A, VARIAR HB, SHRIVASTAVA M
IEEE ELECTRON DEVICE LETTERS
MEERSHA A, KUMAR J, MISHRA A, VARIAR HB, SHRIVASTAVA M
NANO LETTERS
LIU LF, KRASAVIN AV, LI JL, LI LJ, YANG L, GUO X, DAI DX, ZAYATS AV, TONG LM, WANG P
MATERIALS LETTERS
ASSAD H, FATMA I, KUMAR A
MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING
AGRAWAL A, CHARLESTON J, MIRZAEIFAR R
SYMMETRYBASEL
POUR GB, ASHOURIFAR H, AVAL LF, SOLAYMANI S
MATERIALS
BAIMOVA JA, SHCHERBININ SA
ACS APPLIED ELECTRONIC MATERIALS
SHEN N
JOURNAL OF ALLOYS COMPOUNDS
SONG S, KIM SH, KIM SG, HAN KH, KIM HJ, YU HY
MOLECULES
MANOUSI N, KABIR A, FURTON KG, ANTHEMIDIS A