国家/地区 |
Finland(3)![]() |
关键词 |
PRINTING(3)![]() |
出版物 | |
出版时间 | |
机构 | |
作者 | ERMOLOV V(2) |
IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY
JAAKKOLA K, SANDBERG H, LAHTI M, ERMOLOV V
IEEE ANTENNAS WIRELESS PROPAGATION LETTERS
LAMMINEN A, ARAPOV K, DE WITH G, HAQUE S, SANDBERG HGO, FRIEDRICH H, ERMOLOV V
PHYSICA STATUS SOLIDI AAPPLICATIONS MATERIALS SCIENCE
KORHONEN H, SINH LH, LUONG ND, LEHTINEN P, VERHO T, PARTANEN J, SEPPALA J