国家/地区 China（2）
关键词 STEP RESPONSE（3）
出版物
出版时间 2020（2）
机构 SOUTH CHINA .（2）
作者 PAN ZL（2） XU P（2）

The insertion of high-k dielectric materials in multilayer graphene nanoribbon interconnects for reducing propagation delay and expanding bandwidth

ORGANIC ELECTRONICS

XU P, PAN ZL

Collaborative Applying the Ultra-low-k Dielectric and the High-k Dielectric Materials for Performance Enhancement in Coupled Multilayer Graphene Nanoribbon Interconnects

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY

XU P, PAN ZL

Analysis of Multilayer Graphene Nanoribbon Interconnects Constrained by Structural Edge Roughness and Corrugated Surface Dielectric

PHYSICA STATUS SOLIDI AAPPLICATIONS MATERIALS SCIENCE

UPADHYAY A, RAI MK, KHANNA R