国家/地区 China（3）
关键词 INTERLAYER SP 3 BOND（3）
出版物
出版时间
机构 SHANGHAI UNI.（2）
作者 FAN L（3）

Research on correlation of mechanical behavior of multilayer in-plane graphene/hexagonal boron nitride heterostructures in the presence of Stone-Wales defects and interlayer sp(3) bonds with multiple physical fields

COMPUTATIONAL MATERIALS SCIENCE

YAO WJ, FAN L, ZHANG ZP

Regulation and coupling effects on mechanical properties of copper-graphene/h-BN layered heterostructure via ion irradiation, interlayer sp(3) bonds and temperature

MATERIALS RESEARCH EXPRESS

FAN L, YAO WJ

Reduction of interfacial thermal transport of bilayer in-plane graphene/hexagonal boron nitride heterostructures via interlayer sp3 bonds, defects and stacking angle

DIAMOND RELATED MATERIALS

FAN L, YAO WJ