国家/地区 China（12）
关键词 THERMAL CONDUCTIVITY（12）
出版物 COMPOSITES COMMUNIC.（3） CHEMICAL ENGINEERIN.（2） FIBERS POLYMERS（2）
出版时间 2022（4） 2015（2） 2021（2）
机构 CHINESE ACAD.（3）
作者 YU JH（12）

Constructing a "pea-pod-like" alumina-graphene binary architecture for enhancing thermal conductivity of epoxy composite

CHEMICAL ENGINEERING JOURNAL

CHEN YP, HOU X, LIAO MZ, DAI W, WANG ZW, YAN C, LI H, LIN CT, JIANG N, YU JH

Largely enhanced thermal conductivity of ethylene-propylene-diene monomer composites by addition of graphene ball

COMPOSITES COMMUNICATIONS

MA AJ, WANG XJ, CHEN YP, YU JH, ZHENG WG, ZHAO YQ

Permittivity, Thermal Conductivity and Thermal Stability of Poly(vinylidene fluoride)/Graphene Nanocomposites

IEEE TRANSACTIONS ON DIELECTRICS ELECTRICAL INSULATION

YU JH, HUANG XY, WU C, JIANG PK

Enhancing the thermal, electrical, and mechanical properties of silicone rubber by addition of graphene nanoplatelets

MATERIALS DESIGN

SONG YZ, YU JH, YU LH, ALAM FE, DAI W, LI CY, JIANG N

Enhanced Thermal Properties for Epoxy Composites with a Three-dimensional Graphene Oxide Filler

FIBERS POLYMERS

GAO J, YU JH, WU XF, RAO BL, SONG LF, HE ZH, LU SR

A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity

CHINESE JOURNAL OF CHEMISTRY

GONG JR, TAN X, YUAN QL, LIU ZD, YING JF, LV L, YAN QW, CHU WB, XUE C, YU JH, NISHIMURA K, JIANG N, LIN CT, DAI W

Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

COMPOSITES COMMUNICATIONS

LIU DK, ZHAO JX, NING YY, MA HB, WANG B, LU YX, LI W, LI LH, DAI W, LIN CT, JIANG N, XUE C, YU JH

Ultrahigh Thermal Conductivity of Epoxy Composites with Hybrid Carbon Fiber and Graphene Filler

FIBERS POLYMERS

ALI ZL, KONG XD, LI MH, HOU X, LI LH, QIN Y, SONG GC, WEI XZ, ZHAO S, CAI T, DAI W, LIN CT, JIANG N, YU JH

Significantly thermally conductive cellulose composite film with graphene/ boron nitride heterojunction structure achieved by combustion synthesis

COMPOSITES COMMUNICATIONS

GONG P, LI LH, LI MH, ZHANG SY, YANG FX, WANG YD, KONG XD, CHEN HY, JIAO CC, RUAN XX, CAI T, DAI W, PAN ZB, LI Y, XU LL, LIN CT, JIANG N, YU JH

Lightweight thermal interface materials based on hierarchically structured graphene paper with superior through-plane thermal conductivity

CHEMICAL ENGINEERING JOURNAL

GAO JY, YAN QW, LV L, TAN X, YING JF, YANG K, YU JH, DU SY, WEI QP, XIANG R, YAO YG, ZENG XL, SUN R, WONG CP, JIANG N, LIN CT, DAI W