国家/地区 | China(9) |
关键词 | THERMAL CONDUCTIVITY(9) |
出版物 | COMPOSITES COMMUNICATIONS(9) |
出版时间 | 2021(3) 2020(2) 2023(2) |
机构 | |
作者 |
YU JH(3)
DAI W(2)
DING P(2)
JIANG N(2)
LI LH(2) LIN CT(2) SHI LY(2) SONG N(2) |
COMPOSITES COMMUNICATIONS
JIANG F, CUI XL, SONG N, SHI LY, DING P
COMPOSITES COMMUNICATIONS
CAI XZ, DONG XZ, LV WX, JI CZ, JIANG ZY, ZHANG XR, GAO T, YUE K, ZHANG XX
COMPOSITES COMMUNICATIONS
MA AJ, WANG XJ, CHEN YP, YU JH, ZHENG WG, ZHAO YQ
COMPOSITES COMMUNICATIONS
LIU DK, ZHAO JX, NING YY, MA HB, WANG B, LU YX, LI W, LI LH, DAI W, LIN CT, JIANG N, XUE C, YU JH
COMPOSITES COMMUNICATIONS
JIAO DJ, SONG N, DING P, SHI LY
COMPOSITES COMMUNICATIONS
GAO M, PENG K, PAN TS, LONG F, LIN Y
COMPOSITES COMMUNICATIONS
GONG P, LI LH, LI MH, ZHANG SY, YANG FX, WANG YD, KONG XD, CHEN HY, JIAO CC, RUAN XX, CAI T, DAI W, PAN ZB, LI Y, XU LL, LIN CT, JIANG N, YU JH
COMPOSITES COMMUNICATIONS
YAN MM, CHEN XG, XU YY, PAN Y, LI JL, LI JL, WU T, ZHENG HL, CHEN XX, HE JX
COMPOSITES COMMUNICATIONS
YUAN H, LI T, WANG Y, WANG XF, ZHANG XH, XIA BH, MA PM, LIU TX, CHEN MQ, DONG WF