国家/地区 China（2）
关键词 SOLDER JOINT（2）
出版物
出版时间
机构 HARBIN UNIV SCI TECHNOL（2）
作者 ZHANG H（2）

Effect of Ni Addition in Sn0.7Ag0.5Cu on Interfacial Reaction and IMC Growth of Cu and Graphene-coated Cu Substrates

RARE METAL MATERIALS ENGINEERING

CAI HM, LIU Y, ZHANG H, LI SL, SUN FL, ZHANG GQ

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

MODERN PHYSICS LETTERS B

CAI HM, LIU Y, LI SL, ZHANG H, SUN FL, QI JL