国家/地区 China（9）
关键词 COMPOSITE SOLDER（4） BALL MILLING METHOD（2） NANOINDENTATION（2）
出版物 MATERIALS SCIENCE E.（4） JOURNAL OF ALLOYS C.（2）
出版时间 2015（2）
机构 TIANJIN UNIV（9）
作者 WEI J（9）

A modified constitutive model of Ag nanoparticle-modified graphene/Sn-Ag-Cu/Cu solder joints

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

HAN YD, GAO Y, JING HY, WEI J, ZHAO L, XU LY

Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

HAN YD, GAO Y, ZHANG ST, JING HY, WEI J, ZHAO L, XU LY

Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

JOURNAL OF ELECTRONIC MATERIALS

XU LY, ZHANG ST, JING HY, WANG LX, WEI J, KONG XC, HAN YD

Ag-graphene hybrid conductive ink for writing electronics

NANOTECHNOLOGY

XU LY, YANG GY, JING HY, WEI J, HAN YD

Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

LIU XD, HAN YD, JING HY, WEI J, XU LY

Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers

JOURNAL OF ALLOYS COMPOUNDS

JING HY, GUO HJ, WANG LX, WEI J, XU LY, HAN YD

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

XU LY, CHEN X, JING HY, WANG LX, WEI J, HAN YD

Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints

JOURNAL OF ALLOYS COMPOUNDS

XU LY, WANG LX, JING HY, LIU XD, WEI J, HAN YD

Effect of graphene nanosheets on the corrosion behavior of Sn-Ag-Cu solders

JOURNAL OF MATERIALS SCIENCEMATERIALS IN ELECTRONICS

XU LY, ZHANG ZK, JING HY, WEI J, HAN YD