国家/地区 India（3）
关键词 COPPERGRAPHENE（3）
出版物
出版时间 2020（2）
机构 INDIAN INST .（2）
作者 PANDEY PM（2） SINGH G（2）

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Rapid manufacturing of copper-graphene composites using a novel rapid tooling technique

RAPID PROTOTYPING JOURNAL

SINGH G, PANDEY PM

Topological ordered copper graphene composite foam: Fabrication and compression properties study

MATERIALS LETTERS

SINGH G, PANDEY PM