国家/地区 Usa（3）
关键词 INTERCONNECT（3）
出版物 IEEE ELECTRON DEVIC.（2）
出版时间
机构 STANFORD UNIV（3）
作者 WONG HSP（3）

In-Situ Grown Graphene Enabled Copper Interconnects With Improved Electromigration Reliability

IEEE ELECTRON DEVICE LETTERS

LI L, ZHU ZW, YOON A, WONG HSP

Graphene Interconnect Lifetime: A Reliability Analysis

IEEE ELECTRON DEVICE LETTERS

CHEN XY, SEO DH, SEO S, CHUNG H, WONG HSP

Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics

IEEE TRANSACTIONS ON ELECTRON DEVICES

CHEN XY, AKINWANDE D, LEE KJ, CLOSE GF, YASUDA S, PAUL BC, FUJITA S, KONG J, WONG HSP