国家/地区 China（4）
关键词 COMPOSITE SOLDER（3）
出版物 JOURNAL OF ALLOYS C.（2）
出版时间
机构 TIANJIN UNIV（4）
作者 WANG LX（4）

Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

JOURNAL OF ELECTRONIC MATERIALS

XU LY, ZHANG ST, JING HY, WANG LX, WEI J, KONG XC, HAN YD

Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers

JOURNAL OF ALLOYS COMPOUNDS

JING HY, GUO HJ, WANG LX, WEI J, XU LY, HAN YD

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING

XU LY, CHEN X, JING HY, WANG LX, WEI J, HAN YD

Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints

JOURNAL OF ALLOYS COMPOUNDS

XU LY, WANG LX, JING HY, LIU XD, WEI J, HAN YD