国家/地区
关键词 RESISTANCE（2）
出版物 IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY（2）
出版时间 2020（2）
机构
作者

A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper- Graphene Hybrid On-Chip Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

KUMAR R, KUMAR A, GUGLANI S, KUMAR S, ROY S, KAUSHIK BK, SHARMA R, ACHAR R

Assembly Process and Electrical Properties of Top-Transferred Graphene on Carbon Nanotubes for Carbon-Based 3-D Interconnects

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

ZHU Y, TAN CW, CHUA SL, LIM YD, VAISBAND B, TAY BK, FRIEDMAN EG, TAN CS