国家/地区
关键词
出版物 IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY（2）
出版时间 2018（2）
机构
作者

Graphene Packaging for Thermal Management of Innovative Complementary Collector-Up Heterojunction Bipolar Transistors

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

DU WM, TSENG HC

Thermal Management of Electronic Devices Using Combined Effects of Nanoparticle Coating and Graphene-Water Nanofluid in a Miniature Loop Heat Pipe

IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY

THARAYIL T, ASIRVATHAM LG, RAJESH S, WONGWISES S