国家/地区 韩国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC
发明人
公开年
申请年 2017（2）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Producing ink useful for three-dimensional printing of pattern structure, comprises e.g. preparing source solution by mixing graphene oxide or metal salt with first solvent, increasing viscosity of source solution to produce gel source.

AHN H, SUNG K H, SONG C, KIM H S