国家/地区 中国（3）
IPC部 B（3）
IPC大类 C25（3） B05（2） C09（2）
IPC小类 C25D（3） B05D（2） C09D（2）
IPC C25D005/00（3）
发明人
公开年
申请年 2021（3）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Improving corrosion resistance of nanodeposition graphene nanocomposite ceramic coatings comprise e.g. preparing nano-deposited graphene coating slurry, mixing, curing nano-deposited graphene coating slurry, and adding complexing agent.

XUE G