国家/地区 中国（4） 世界知识产权组织（2）
IPC部 B（5）
IPC大类 B32（5） C08（4） C09（2）
IPC小类 B32B（5）
IPC B32B009/02（2） B32B009/04（2） B32B033/00（2）
C08J005/18（2） C08K003/04（2） C08K005/053（2）
C08L005/00（2）
发明人 LI Y（5）
公开年 2022（4）
申请年 2021（5）
专利权人 UNIV SHAANXI.（2）

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Preparing composite film for warning film rupture, comprises preparing konjac glucomannan solution glue, carrying out gradient dilution of konjac glucomannan, and adding glycerin and graphene oxide solution under mixing and stirring.

MAO G, WANG Y, ZHAO X, ZHANG F, LI Y

Composite material used for improving electroconductivity of metal, has graphene fragment layer that comprises graphene fragments uniformly spread on metal foil layer.

GONG M, SUN B, WANG Y, CHEN Q, YANG W, LI Y, LIANG J, LIU B, ZHANG X, PEI Z

Preparing a konjac glucomannan composite film comprises eluting konjak fine powder, drying, grinding and sieving, adding glycerin, silver bromide and water, preparing an aramid fiber sol film, mixing and stirring the mixture to obtain an nano-fiber nano-sol film and drying.

MAO G, WANG Y, DOU X, YAN W, ZHAO X, ZHANG F, LI Y

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H