国家/地区 日本（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC
发明人
公开年
申请年 2021（2）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Thermally-conductive film of heating apparatus mounted in gas turbine engine, comprises graphene sheet and resin sheet that are formed in sheet form by making surface direction or out-plane direction into thickness direction.

IKEDA K, ISHIKAWA N, FUNATSU T, OYAMA K