国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08L（2）
IPC C09D007/61（2）
发明人 ZHANG G（2）
公开年 2022（2）
申请年 2022（2）
专利权人

Conductive repair solution for repairing cable buffer layer ablation failure, comprises component-A (comprised of e.g. cunductive filler, catalyst, surfactant, nano copper silicide, and boron nitride) and component-B (comprised of vinyl silicone oil, thickening agent, and antifoaming agent).

LI H, RUAN Y, ZHANG F, ZHANG G, SHI Y, HAN Z, LI M, HUANG J

Preparing polyphenol-modified polymer film useful in preparing medical device, packaging material, printed matter or electronic component, comprises providing polymer layer and performing corona treatment on surface of polymer layer, coating modified liquid on surface of polymer layer and drying.

ZHANG G, LI X, XIA J, ZHU Z