国家/地区 中国（2）
IPC部 C（3）
IPC大类 C25（3） H01（3）
IPC小类 C25D（3）
IPC C25D015/00（3）
发明人
公开年 2022（2）
申请年 2022（3）
专利权人

Silver-graphene composite plating layer, has layer main body provided with first nano-silver layer, silver-graphene layer and second nano-silver layer that are sequentially arranged on base body.

LI H, ZHAO K, ZHANG Q, CHEN B, GUO W, ZHU Z, ZHANG C, DING Y, PANG Z

Electrolyte for electrodeposition of copper on semiconductor substrate, comprises copper ions, solvent, and amine that complexes copper ions and graphene.

MEVELLEC V, DOUSSOT C P, CAILLARD L

Packaging carrier plate has alumina ceramic plate whose one surface has three-dimensional conical structure layer of alumina ceramic, where copper-graphene composite material layer is compounded on three-dimensional conical structure layer.

LIANG N, WU S, WANG J, SUN C, ZHANG D, ZHANG W, SONG X